micro chip scanning

Fumax Tech ofa pito i luga lolomi Lolomi Komiti Faatino (PCB) aofia ai tele-vaega PCB (lolomi laupapa matagaluega), maualuga-tulaga HDI (maualuga density vavalalata-fesoʻotaʻiga)

I le avea ai o se faʻavae mea, Fumax malamalama i le taua o le faʻatuatuaina tulaga lelei o le PCB. Matou te teu faʻafaigaluega i sili atu mea faigaluega ma talenia 'au e faʻatupuina laupapa sili ona lelei.

O vaega masani a le PCB o loʻo i lalo.

PCB maumaututū

PCB fetuutuunai ma fetuutuunai

HDI PCB

Maualuga Faʻafia PCB

Maualuga TG PCB

PCB TAITAIINA

Uamea PCB autu

Mafiafia Cooper PCB

Alumini PCB

 

O a matou agavaʻa gafatia o loʻo faʻaalia i le siata i lalo.

Ituaiga

Malosiaga

Vaaiga

Multilayers (4-28) 、 HDI (4-20) Flex 、 Maumaututū Flex

Itu Faʻalua

CEM-3 、 FR-4 、 Rogers RO4233 、 Bergquist Thermal Clad 4mil – 126mil (0.1mm-3.2mm)

Multilayers

4-28 faaputuga, laupapa mafiafia 8mil-126mil (0.2mm-3.2mm)

Tanu / Tauaso Via

4-20 faaputuga, laupapa mafiafia 10mil-126mil (0.25mm-3.2mm)

HDI

1 + N + 1、2 + N + 2、3 + N + 3 、 Soʻo se vaega

Flex & Maumaututū-Flex PCB

1-8layers Flex PCB, 2-12layers Maumaututū-flex PCB HDI + PCB maumaututū-fetuʻu

Laminate

 

Ituaiga Soldermask (LPI)

Taiyo 、 Goo's 、 Probimer FPC .....

Peelable Soldermask

 

Vaitusi carbon

 

HASL / Lead Free HASL

Mafiafia: 0.5-40um

OSP

 

ENIG (Ni-Au)

 

Electro-bondable Ni-Au

 

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm

Eletise Auro malo

 

Apa mafiafia

 

Malosiaga

Gaosiga o Misasa

Min Faʻaviliina Faʻafanua Faʻavae

0.20mm

Min. Leisa Faʻavaga Luga

4mil (0.100mm)

Line lautele / Avanoa

2mil / 2mil

Max. Tele vaega

21.5 "X 24.5" (546mm X 622mm)

Line lautele / Spacing Faapalepale

Leai eletise ufiufi: +/- 5um , Eletise ufiufi: +/- 10um

Faapalepale PTH Polo

+/- 0.002 inisi (0.050mm)

Faʻapalepale NPTH pu

+/- 0.002 inisi (0.050mm)

Faapalepale Nofoaga Tulaga

+/- 0.002 inisi (0.050mm)

Faʻaputuga i le Faapalepale i le Tuma

+/- 0.004inch (0.100mm)

Tago i le Tali Faapalepale

+/- 0.004inch (0.100mm)

Faʻaputuga i le Faʻapalepale Layer

+/- 0.003inch (0.075mm)

Faapalepale Impedance

+/- 10%

Taua Warpage%

Max≤0.5%

Tekonolosi (HDI Oloa)

MEA FAI

Gaosiga

Leisa Via vili / Pad

0.125 / 0.30 、 0.125 / 0.38

Tauaso Via Drill / Pad

0.25 / 0.50

Line lautele / Avanoa

0.10 / 0.10

Faʻavae Faʻavae

Leisa Direct Drill

Fausia Up Mea

FR4 LDP (LDD); RCC 50 ~ 100 micron

Cu Mafiafia i luga o le Pu o le Pu

Pu tauaso: 10um (min)

Vaega Fua Faʻatusatusa

0.8: 1

Tekonolosi (PCB fetuutuunai)

Poloketi 

Malosiaga

Lisi e taavale (tasi le itu)

IOE

Lisi e taavale (lua)

LEAI

Volume e taavale mea lautele lautele mm 

250

Laititi gaosiga tele mm 

250x250 

Tapulaa maualuga gaosiga mm 

500x500 

SMT Assembly patch (Ioe / Leai)

IOE

Malosiaga Gap Air (Ioe / Leai)

IOE

Gaosiaina o le maaa ma le malu gaugau ipu (Ioe / Leai)

IOE

Max faaputuga (Faigata)

10

Laʻau aupito maualuga (ipu Filemu)

6

Saienisi Mea 

 

PI

IOE

PET

IOE

Apamemea eletise

IOE

Faasolo apamemea pepa alumini

IOE

PI

 

Ufiufiina o tifaga faʻatulagaina faapalepale mm

± 0,1 

Maualalo ufiufi mm ata

0.175

Faamalosia 

 

PI

IOE

FR-4

IOE

SUS

IOE

EMI FAIGA

 

Vaitusi Siliva

IOE

Ata Tifaga Siliva

IOE